Researchers at the University of Alabama have introduced a new way to deposit thin layers of atoms as
“ALD is a method of applying three-dimensional thinfilms, which plays an important role in the production of microelectronics, in particular, elements such as central processing units, memory and hard drives, ”the scientists note. Each ALD cycle applies a layer several atoms deep.
ALD processes typically use heatedmolecules in the gas phase that evaporate from solid or liquid form - much like indoor humidifiers, which use heat to evaporate water. However, in this process, some chemical elements are unstable and can decompose before the vapor pressure begins.
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“Ultrasonic atomization developed by ourresearch group, allows you to obtain precursors with low vapor pressure, since evaporation occurred due to the ultrasonic vibration of the module. As with a household humidifier, ultrasonic atomization creates a mist of saturated steam and micro-droplets. Droplets of micron size are continuously evaporated and applied to the surface of the material, ”the researchers noted.
This process uses ultrasonica transformer placed in a liquid chemical precursor. Once launched, the device vibrates at a rate of several hundred times per second and creates a mist of material. Small droplets of liquid in the fog quickly evaporate in the gas manifold under vacuum and gentle heat treatment, leaving behind an even layer of applied material.
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