ASUS is gearing up to unveil its next gaming flagship, the ROG Phone, which, as previously confirmed,
will be built on Snapdragon 8 Gen 1.Since the announcement of the presentation date (July 5), the Taiwanese have not spoiled us with new teasers on the smartphone, but now they have taken the floor and told us something curious.ROG Phone 6 will get significantly improved cooling features: a 30% larger vapor chamber and an 85% (!) larger graphite plate.This, it seems, the manufacturer hints that the overclocked Qualcomm flagship will also begenerate a lot of heat, just like its current counterpart, so the leading game phone will need additional support.In previous generations, the stability of the ROG Phone was very good.
Note that Qualcomm Snapdragon 8 Gen 1 hasnoticeable problems with heating, due to which throttling is felt more strongly than the user would like. Snapdragon 8+ Gen 1 should switch to TSMC's 4nm architecture (Samsung's standard eight), which is supposedly designed to increase stability and level out some of the throttling. ROG Phone 6 will be one of the first to put these hopes to the test. We wait!
