Engineers taught electronics to “sweat” for cooling

An article was published in the scientific journal Joule, which talks about the new discovery of Chinese scientists

- they managed to teach electronics to “sweat” so that it could cool itself if necessary.

So, the engineers suggested usingmetal-organic frame structures, due to the presence of which there are many micropores, it will be possible to collect the necessary moisture from the air. In the future, similar structures can be used when coating heated surfaces - with a small heating of the processor they will collect water, and when heated, on the contrary, they will evaporate it, preventing the temperature from rising.

As a result, scientists were able to successfully cover the platean area of ​​162 cm of approximately 0.3 g of this material. As a result, the time required to heat the plate to 60 ° C more than doubled: from 5 to 11 minutes. It is important to note that the layer deposited on top of the plate was only 198 microns, and when this value was increased to 516 microns, it took even longer to heat up - 19 minutes!