Taiwanese semiconductor manufacturer TSMC was able to release the world's first chip made using
What is known
The company created a new chip for the developerAlphaware semiconductor chips. The ZeusCORE100 1-112Gbps NRZ/PAM4 Serialiser-Deserialiser (SerDes) sample consists of two functional blocks. They are usually used to convert information between parallel and serial interfaces.
In the next 2-3 years, TSMC wants torelease five variants of the 3nm process at once. The N3 technology will be targeted at key customers such as Apple in the US. The second generation (N3E) will provide an opportunity to accelerate the release of chips, while increasing performance and reducing power consumption.
</ img>
Launch of mass production of microchipsN3E technology will take place about a year after the start of mass production of chips created using the N3 process technology, i.e. not until the middle of next year. After that, TSMC intends to start creating chips using N3S and N3P technologies to create high-density transistor chips and high-performance chips, respectively. The manufacturer wants to realize his plans in 2024.
The last of five N3 process options is N3X. It will appear in 2025 and will become the main one for high-performance processors.