TSMC spoke at the North American Technology Symposium 2022, where it spoke about the prospects for its work in the coming years. Main
the block was a new approach to productionarchitecture for mobile chipsets FinFlex, which is an advanced toolkit for chipset developers to customize their chips. The idea is that developers can choose one of three Fin blocks to build individual blocks of their product to achieve what they need specifically. Fin blocks are labeled as follows: 3-2 for maximum performance, 2-1 for maximum energy efficiency and 2-2 for balance. Each selected block will be customized separately, without affecting neighboring blocks. This will allow you to more precisely control performance and energy efficiency, as well as reduce the space required.
FinFlex technology will be implemented for the first time ingeneration N3 at the end of 2022 (3 nm), and then will be developed into N2, which will be ready by 2025 (2 nm). By the way, N2 will improve performance and energy efficiency through the use of nanosheet transistor technology. Recall that TSMC's current 4nm architecture is implemented in Snapdragon 8+ Gen 1, which enters the market in July.
© Artur Luchkin.
According to TSMC